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| Filtronic Solid State Features * * * * * * * * * * 5.5dB Typical Noise Figure 7.5dB Typical Gain 15dBm Saturated Output Power 12dB Input/Output Return Loss Typical 2-18GHz Frequency Bandwidth +4 Volts Dual Bias Supply DC Decoupled RF Output Chip Size : 1.62mmX2.38mm (.064"X.094") Chip Thickness : 100m 2 Pad Dimension : 100m 2-18 GHz MESFET Amplifier LMA184 Description The Filtronic LMA184 is a GaAs monolithic distributive amplifier which operates from 2 to 18GHz. This LMA184 amplifier produces a typical gain of 7.5dB and a noise figure of less than 5.5dB. The LMA184 is suitable for gain block, low noise and driver amplifier applications. DC decoupled output RF port. Ground is provided to the circuitry through vias to the backside metallization. Electrical Specifications at Ta=25C (VDD=+4.0V, Zin=Zout=50) Limit Typ. 7.5 120 .5 5.5 -14 -14 -16 12 Symbol BW S21 Idss S21 NF RLin RLout S12 P-1dB Parameter Operating Bandwidth Small Signal Gain Drain Current at Saturation Small Signal Gain Flatness Noise Figure Input Return Loss Output Return Loss Reverse Isolation 1-dB Gain Compression Power Test Conditions VD=4V, Ids=.5Idss Min. 2 6 60 Max. 18 180 1 7 -10 -10 @ .5Idss -13 10 Units GHz dB mA dB dB dB dB dB dBm Absolute Maximum Ratings Symbol Vdd Idd Pin Pt Tch Tstg Tmax. Parameter/Conditions Drain Supply Voltage Total Drain Current RF Input Power Power Dissipation Operating Channel Temperature Storage Temperature Max. Assembly Temp. (1 min. max.) Min. Max. 8 180 20 1.5 150 165 300 Units Volts mA dBm W C C C -65 Notes : 1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. 2. Specifications subject to change without notice. DSS 008 WC Phone: (408) 988-1845 Internet: http://www.FiltronicSolidState.com Fax: (408) 970-9950 Filtronic Solid State 2-18 GHz MESFET Amplifier LMA184 Assembly Diagram Notes: 1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. 2.) The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150C for 45 minutes. 3.) Bond on bond or stitch bond acceptable. 4.) Conductor over conductor acceptable. Conductors must not short. DSS 008 WC Phone: (408) 988-1845 Internet: http://www.FiltronicSolidState.com Fax: (408) 970-9950 Filtronic Solid State 2-18 GHz MESFET Amplifier LMA184 Mechanical Outline Notes: 1.) Unless Otherwise specified. 2.) All units are in micron (m). 3.) All bond pads are 100 X 100 m2. 4.) Bias pad (VDD) size is 100 X 121.5 m2. DSS 008 WC Phone: (408) 988-1845 Internet: http://www.FiltronicSolidState.com Fax: (408) 970-9950 |
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